†first author / *corresponding author
†first author / *corresponding author
I. International Journal:
Y.Kim†, H.Lee, C.Yoon, C.Han, D.Shin, S.Lee*, H.Lee*, Physics-Informed Thermal Spreading Prediction Enabling High-Power Multichip Modules (submitted)
Y.Kim†, S.Jeong, N.Kang, C.Han, D.Shin, H.Lee*, H.Lee*, Physics Regulated Genetic Algorithm for Optimization of Multi-Jet Impingement Cooling (in revision)
D. Kong†, H. Kwon, H. Lee, H. Lee, M. Asheghi, K. E. Goodson*, Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 CM× 3 CM) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers, Journal of Electronic packaging (2025)
H. Lee†, C. Lee, H. Lee*, Physics-informed machine learning for enhanced predicting condensation heat transfer, Energy and AI (2025), (IF 9.6, JCR top 6.9%)
H. Lee†, G. Lee, K. Kim, D. Kong, H. Lee*, Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks, Case Studies in Thermal Engineering (2024), 57, 104331. (IF 6.4, JCR top 5.8%)
H. Lee†, K. Kim, D. Kong, D. Lee, H. Jun, H. Lee*, Dynamic artificial neural network model for ultra-low temperature prediction in hydrogen storage tank, Journal of Energy Storage (2023), 69, 107866. (IF 8.9, JCR top 16.7%)
K. Kim†, H. Lee, M. Kang, G. Lee, K. Jung, C. R. Kharangate, M. Asheghi, K. E. Goodson, H. Lee*, A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks, Int. J. Heat Mass Transfer 194 (2022) 123087. (IF 5.0, JCR top 9.7%)
E. Cho†, H. Lee†, D. Jung, M. Kang, G. Lee, S. Lee, C.R. Kharangate, H. Ha, S. Huh, H. Lee*, A neural network model for free-falling condensation heat transfer in the presence of non-condensable gases, Int. J. Thermal Science (2022) 107202. (IF 4.9, JCR top 15%)
H. Lee†, M. Kang†, K.W. Jung, C.R. Kharangate, S. Lee, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*, An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sinks, Applied Thermal Engineering (2021) 117012. (IF 6.1, JCR top 5.2%)
D. Jung†, H. Lee, D. Kong, E. Cho, K.W. Jung, C.R. Kharangate, M. Iyengar, C. Malone, M. Asheghi, K.E.Goodson, H. Lee*, Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits, Int. J. Heat Mass Transfer 175 (2021) 121192. (IF 5.0, JCR top 9.7%)
II. Domestic Journal & Conference Papers and Presentations:
Y. Kim†, H. Lee, C. Han, D. Shin and H. Lee*, Physics regulated genetic algorithm for optimization of multi-jet impingement cooling, Thermal Engineers of Korean Society of Mechanical Engineers, 2025.
S. Bae†, H. Lee, H. Kim, C. Lee and H. Lee*, Analysis of LN₂ cryogenic flow characteristics according to aspect ratio of rectangular microchannel, Thermal Engineers of Korean Society of Mechanical Engineers, 2025.
H. Lee†, C. Lee, D. Kong, H. Lee*, Nusselt-constrained physics-driven learning for condensation heat transfer in non-condensable gas, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Jose, CA, Oct 8- Oct 10, 2024.
D. Kong†, H. Kwon, H. Lee, H. Lee, M. Asheghi, K. E. Goodson*, Computational Fluid Dynamics (CFD) modeling and optimization of large-scale (3 cm x 3 cm) silicon-based embedded microchannels with 3D manifold micro-coolers, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Jose, CA, Oct 8- Oct 10, 2024.
H. Lee†, C. Lee, H. Lee*, Physics-driven learning for two phase heat transfer, Korean Society of Mechanical Engineers, Jeju, 2024.
H. Lee†, H. Lee*, H. Jun, C. Jeong, D. Lee, S. W. Kim, Performance analysis of heat exchanger for cryogenic chamber for safety evaluation of hydrogen parts, Trans. Korean Soc. Mech. Eng. B. 46(4) pp. 187~193, 2022.
H. Lee†, C. Kharangate, H. Lee*, Multimodal prediction for flow boiling heat transfer, ASME International. Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Orange County, CA, Oct 25- Oct 27, 2022.
H. Lee†, K. Kim, M. Kang, H. Lee*, H. Jeon, C. Jung, K. Ha, D. Baek, S. Kim, Development of dynamic artificial intelligence network model for efficiency and temperature of hydrogen heat exchanger, Korean Automotive Safety Academic Conference, Yeosu, 2021.
D. Baek†, H. Jun, H. Lee, Y. Kim, G. Lee, H. Lee*, Hydrogen component safety evaluation technology and equipment development, Korean Automotive Safety Academic Conference, Jeju, 2020.
E. Cho†, D. Jung, H. Lee, M. Kang, H. Lee*, Prediction modelling of condensation heat transfer in non-condensable gas using artificial neural network, Korean Society of Mechanical Engineers, online, 2020.
H. Lee†, D. Jung, M. Kang, D. Kong, H. Lee*, Analysis of two-phase pressure drop and flow boiling heat transfer in micro-pin fin heat sink, Korean Society of Mechanical Engineers, online, 2020.
D. Jung†, D. Kong, M. Kang, H. Lee and H. Lee*, Thermal and hydraulic analysis in embedded micro-pin fin arrays for high performance 3D ICS, Thermal engineers of Korean Society of Mechanical Engineers, 2019.